| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component 1 that can endure stress, such as deformation of a circuit board and drop impact, after being mounted on the circuit board.SOLUTION: An electronic component 1 includes a through electrode 5 extending between a first surface P1 and a second surface P2 of a base member 2. An electronic element 4 is mounted on the first surface P1. The second surface P2 includes: a conductive layer 7 being in continuity with the through electrode 5; a stress relaxation layer 9 disposed in a region in which the conductive layer 7 is disposed; and an external electrode 11 formed in the stress relaxation layer 9 and electrically connected to the conductive layer 7 via an opening 10 formed in the stress relaxation layer 9. A contact region CR, in which the stress relaxation layer 9 and the second surface P2 come in contact with each other via an opening formed in the conductive layer 7, is formed in a laminate region SR in which the conductive layer 7 and the stress relaxation layer 9 are overlapped with each other. This improves adhesion between the stress relaxation layer 9 and the conductive layer 7. |
