| 摘要 |
PROBLEM TO BE SOLVED: To mainly enable a stress produced inside a solder material to be absorbed.SOLUTION: A solder material 13 includes a solder base material 14 capable of bonding a bonding member 11 and a to-be-bonded member 12 having different thermal expansion coefficients. Then, a hollow body 15, which can be deformed by a stress produced inside the solder base material 14 whose temperature has been dropped to the normal temperature after bonding due to the difference between the thermal expansion coefficient of the bonding member 11 and that of the to-be-bonded member 12, is included in the solder base material 14. |
