发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a cover tape and an electronic component package suppressing vibration of a carrier tape when peeling off the cover tape, and preventing jumping trouble of an electronic component flying out from a storage pocket right before being mounted.SOLUTION: A cover tape for packaging an electronic component (hereinafter, referred to as a cover tape) has a cohesive failure layer, and a base material layer. In the cover tape, an assembly obtained by joining two cover tapes with cohesive failure layers facing inner sides satisfies that peel strength measured in accordance with JISK6854-3 is ≥0.1N/15 mm and ≤5.0N/15 mm, and a difference of a maximum value and a minimum value of the peel strength is ≤1.0N/15 mm.
申请公布号 JP2013193786(A) 申请公布日期 2013.09.30
申请号 JP20120065744 申请日期 2012.03.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 TERAI TATEO;YAMAGUCHI AKIRA
分类号 B65D77/20;B65D65/40;B65D73/02 主分类号 B65D77/20
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