| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package of a WLCSP type in which radiation efficiency is improved.SOLUTION: In a semiconductor package 11 of a WLCSP type in which BGA bumps 16 are formed in a lattice shape on a package bottom face, the BGA bumps 16 are disposed in the lattice shape at a processible minimum pitch, and the BGA bumps 16 are disposed at all lattice points. Any other bump than I/O pins required for the semiconductor package 11 is defined as a dummy bump 16D and the dummy bump 16D is connected to a ground pattern (ground terminal) 16G of the semiconductor package 11. |
