| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate integrated with a radiator, for which the raw material cost and the processing cost are suppressed low and the warpage is reduced, and which includes excellent strength and heat dissipation, and the substrate integrated with a radiator.SOLUTION: A metal circuit board 15 and a metal base plate 20 are joined to a ceramic substrate 10 to form a metal-ceramic joined substrate 2, the metal base plate 20 is disposed by laying it on top of one side of a radiator 30 through a wax material, a fixture 51 having a recessed R surface 55 is disposed by bringing it face to face with the other side of the radiator 30, a fixture 52 having a projecting R surface 56 projecting toward the metal-ceramic joined substrate 2 side is brought into contact with the other side of the metal circuit board 15, and the metal-ceramic joined substrate 2 is thermally joined to the radiator 30 while pressurizing them by the radiator side fixture 51 and the metal-ceramic joined substrate side fixture 52. A curvature radius R (mm) of the projecting R surface 56 and the recessed R surface 55 is 6,500≤R≤bearing(N/mm)×2,000+12,000. |
