发明名称 METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a transparent conductive substrate superior in light transmittance, especially infrared transmittance and lower in a surface specific resistance than conventional one.SOLUTION: The method for manufacturing a transparent conductive substrate comprises the steps of: forming a metal mesh-like conductor layer on a surface of a transparent substrate by applying a metal microparticle suspension including metal microparticles, a dispersant and a solvent to the surface of the transparent substrate, followed by drying; subsequently, bringing an organic solvent into contact with the metal mesh-like conductor layer formed on the surface of the transparent substrate; then bringing an acid solution into contact with the metal mesh-like conductor layer formed on the surface of the transparent substrate, thereby obtaining the transparent conductive substrate having an infrared transmittance of 50% or larger in a wavelength band of 400-2000 nm and a surface resistance of 20 &OHgr;/sq. or smaller.
申请公布号 JP2013196950(A) 申请公布日期 2013.09.30
申请号 JP20120063738 申请日期 2012.03.21
申请人 FUJIMORI KOGYO CO LTD;TODA KOGYO CORP 发明人 TAKEYAMA SHUNSUKE;HIRANO MASAYOSHI;GOTO NOBUHIRO;INABA YUKO;NAKADA KENICHI;YAMANE KAZUMA;KURUMADA KOKEN
分类号 H01B13/00;B32B27/00 主分类号 H01B13/00
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