| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that although a side through hole may be used so as to secure mounting strength, to securely confirm a mounting state and so on when a chip-based component is mounted on another substrate such as a motherboard, measures against flowing of a sealant into the side through hole need to be taken when sealing is performed to protect component elements and so on, and there are problems of exposure of metal at a place unnecessary for mounting and deficiency in adhesive strength of the sealant and metal.SOLUTION: There is provided a wiring board having a vertically non-conductive penetration side through hole structure which has an upper portion filled with a filler and a recessed portion of arbitrary depth at a lower portion. A recessed hollow portion of the side through hole is coated with metal plating. The metal plating functions not only to connect the side through hole and an inner circuit to each other, but also as a reinforcing material for the filler of the upper portion. |
