| 摘要 |
PROBLEM TO BE SOLVED: To reduce joint failure by preventing generation of solder balls and copper peeling.SOLUTION: In a method for manufacturing a liquid discharge head 2 for discharging liquid droplets including a pressure generation means 22 for generating pressure for discharging liquid droplets, a flexible wiring board 23 connected to the pressure generation means 22, and an electric circuit board 3 connected to the flexible wiring board 23, solder 24 is coated at least one of an electrode 23e on the flexible wiring board or an electrode 3e on the electric circuit board. In the longitudinal direction of the electrode 23e on the flexible wiring board, at least one of both ends of the electrode 23e on the flexible wiring board is overlapped in a state of being positioned outside an end of the electrode 3e on the electric circuit board. The solder 24 is melted and hardened by heating from the electrode 23e side on the flexible wiring board to join the electrode 23e on the flexible wiring board and the electrode 3e on the electric circuit board. |
