| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding apparatus that can be miniaturized.SOLUTION: A molding apparatus includes: a fixed mold 40 mounted to a first fixed platen 22; a movable platen 24 mounted movably along a plurality of tie bars 25; a movable mold 50 mounted to the movable platen 24 and press-molding a preboard P1 between itself and the fixed mold 40 to mold a trim board 11; a hydraulic cylinder 27 capable of closing and opening the fixed mold 40 and the movable mold 50; and an injection apparatus 30 capable of injecting molten resin into a mounting boss molding space S3 for molding a mounting boss 12. The fixed mold 40 and the movable mold 50 are disposed in a peripheral end side position of the movable platen 24 in the shifted form of a center axis C1 of the fixed mold 40 and a center axis C2 of the movable mold 50 with respect to a center axis C3 of the movable platen 24. A storage space S1 for storing the injection apparatus 30 is thereby formed between the movable platen 24 and the first fixed platen 22 in the closed state of the fixed mold 40 and movable mold 50. |
