| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable to form a cured film such as a solder resist while having excellent incombustibility, having satisfactory bending resistance and plating resistance (resistance to plating solutions) also.SOLUTION: The photosensitive resin composition contains (A) an acid-modified ethylenically unsaturated group-containing polyurethane resin, (B) a radical polymerizable compound, and (C) a photoinitiator. The (B) radical polymerizable compound contains (B-1) a phosphorus-containing compound having an ethylenically unsaturated group in a molecule, and (B-2) a compound having an urethane structure and a (meta)acryloyl group in a molecule. |
