| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and an electronic device which can prevent residual bubbles of wiring at a part opposite to an active face.SOLUTION: A semiconductor device 100 of a present embodiment comprises: a semiconductor component 2; a wiring board 1 on which a wiring part 17 electrically connected with an active face 2a side of the semiconductor component 2 is formed; and a resin material 20 provided on the wiring board 1 so as to cover at least a connection part of the active face 2a and the wiring part 17. The wiring part 17 is opposite to the active face 2a and includes a thin film part 17a in which a thickness of a part which is not electrically connected with the semiconductor component 2 is thinner compared with the other part. |
