| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a solder joining part between an electronic component and a substrate in an electronic component packaging structure.SOLUTION: An electronic component packaging structure includes: a substrate having a component mounting surface where a wiring pattern including a land is formed; an electronic component having a terminal facing the land; a solder joining part connecting the land with the terminal; and a resin coat part covering at least a part of the solder joining part. The solder joining part includes: a matrix region electrically connecting the land with the terminal; and granular objects dispersed in the matrix region. The solder joining part has irregularities which fit with the shapes of the granular objects on a contact interface with the resin coat part. |
