| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of a semiconductor device, which can prevent swinging of a material to be coated on a substrate at the time of a discharge start and a discharge end of the material.SOLUTION: A semiconductor device manufacturing apparatus according to an embodiment comprises a discharge part and a control part. The discharge part discharges a material to be coated on a substrate. The control part raises a supply pressure of the material to be supplied to the discharge part to a first pressure to cause the discharge part to start discharge of the material; lowers the supply pressure to a second pressure at which the material discharged from the discharge part does not swing and maintains the supply pressure; and subsequently raises the supply pressure to a third pressure to cause the discharge part to terminate discharge of the material. |
