| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic substrate for housing electronic components that is unbreakable even in a sealing process, and an electronic component mounting package using the same.SOLUTION: The ceramic substrate A for housing electronic components, comprises a bottom 3 of a substrate having a mounting face 1 for an electronic component 10 at the center of the top surface, and a bank 5 of the substrate that is integrally formed with the bottom 3 of the substrate and arranged so as to surround the mounting face 1 on the bottom 3 of the substrate, the bottom 3 and bank 5 being made of a sintered body of ceramic particles. The sintered bodies composing the bottom 3 and the bank 5, which have different porosity, respectively have porosity equal to or lower than 3%, and the bank 5 is higher in porosity than the bottom 3, which provides the ceramic substrate A for housing electronic components that is unbreakable even in a sealing process, and the electronic component mounting package using the same. |
