| 摘要 |
<p>Provided are an adhesive film and a tape for semiconductor wafer processing, which are reduced in softening of a bonding agent layer due to the absorption of moisture in the air and are thus capable of suppressing the occurrence of pick up failure. This adhesive film is composed of a base film and an adhesive layer that is provided on the base film, and has a water vapor permeability of 10.0 g/m2/day or less. This tape for semiconductor wafer processing comprises an adhesive film, which is composed of a base film and an adhesive layer that is provided on the base film, and a bonding agent layer that is formed on the adhesive layer, and the adhesive film has a water vapor permeability of 10.0 g/m2/day or less.</p> |
