| 摘要 |
PURPOSE: A method for manufacturing a sputtering target and a sputtering target by the method are provided to control the height of a spacer and to prevent the warpage of a target. CONSTITUTION: A bonding material is arranged in the upper surface of a backing plate(S1). A sinter material is loaded in the upper surface of the bonding material(S2). The bonding material is fused(S3). The fused bonding material is cooled to bond the backing plate and the sinter material(S4). [Reference numerals] (AA) Start; (BB) End; (S1) Step of preparing bonding; (S2) Step of loading a sinter material; (S3) Step of melting a bonding material; (S4) Step of bonding |
