| 摘要 |
PURPOSE: A chamber for high temperature test of a semiconductor device is provided to minimize production cost increase by minimizing temperature difference between sockets and making uniform temperature during the high temperature test. CONSTITUTION: A chamber (100) for high temperature test of a semiconductor device includes a local heating type docking plate (8) and a cooling controller (20). The local heating type docking plate enables local heating and exhaustion in a test socket by arranging a high temperature air feeding pipe (9). The local heating type docking plate uses an air heater as a heat source of the semiconductor device. The local heating type docking plate includes a discharge outlet (10) and a branch hole (11). The discharge outlet discharges high temperature air by an air heater (A) to the test socket for local heating or exhaustion. The branch hole is comprised at each socket, and makes the high temperature air flow away to the socket of the local heating type docking plate. |
