| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for solder bonding which accurately controls a bonding area, a thickness and a shape etc. to reduce die stress.SOLUTION: A method of fabricating a semiconductor comprises: forming a plurality of stud bumps in a pattern having a geometrical shape on a surface of a substrate, the pattern defining a periphery of a bonding area on the surface of the substrate 118; and placing a solder material 120 in the bonding area such that the solder material 120 is surrounded by the stud bumps 110. The solder material is heated to a temperature where the solder material begins to flow within the bonding area. A bonding surface of a die 130 is pressed onto the stud bumps with a sufficient pressure to crush the stud bumps to a predetermined extent such that the solder material substantially evenly spreads between the stud bumps within the bonding area. The solder material is then solidified to form a final solder area that conforms to the geometrical shape of the pattern of stud bumps. |
