Optical Device, Wafer-Scale Package for One Such Optical Device and Corresponding Method

摘要

The invention relates to an optical device produced by cutting a wafer-scale package comprising at least one optical module formed from a substrate (1) pierced with a plurality of through-holes (2) and optical elements disposed in the holes. According to the invention, at least one of the holes receives two lenses (3, 4) made from at least one polymer material transparent in the 400 nm-700 nm range, each of the lenses being defined by an external diopter and an internal diopter. The invention is characterised in that a space is formed between the internal diopters of two lenses and in that the substrate contains no polymer material between two adjacent through-holes.