发明名称 MANUFACTURING METHOD FOR HIGH CAPACITANCE CAPACITOR STRUCTURE
摘要 A manufacturing method of a capacitor structure is provided, which includes the steps of: on a substrate having a first oxide layer, (a) forming a first suspension layer on the first oxide layer; (b) forming a first shallow trench into the first oxide layer above the substrate; (c) forming a second oxide layer filling the first shallow trench; (d) forming a second suspension layer on the second oxide layer; (e) forming a second shallow trench through the second suspension layer into the second oxide layer above the first suspension layer; (f) forming at least one deep trench on the bottom surface of the second shallow trench through the second and the first oxide layers, (g) forming an electrode layer on the inner surface of the deep trench; and (h) removing the first and second oxide layers through the trench openings in the first and the second suspension layers.
申请公布号 US2013252397(A1) 申请公布日期 2013.09.26
申请号 US201213476251 申请日期 2012.05.21
申请人 HUANG SHIN-BIN;HSU CHENG-YEH;HUANG CHUNG-LIN;INOTERA MEMORIES, INC. 发明人 HUANG SHIN-BIN;HSU CHENG-YEH;HUANG CHUNG-LIN
分类号 H01L21/02 主分类号 H01L21/02
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