| 摘要 |
PROBLEM TO BE SOLVED: To provide a camera module which secures air permeability between an internal space of an imaging package and outer air without affecting the inclination of an image pickup device.SOLUTION: A camera module (1) includes: an imaging package (10) where a glass substrate (17) is provided closely contacting with a sensor cover (14) so as to cover an opening (14a), which is a part of the sensor cover (14) covering a solid state image sensor (13) mounted on a wiring board (11) and is provided above the solid state image sensor (13), thereby forming an internal space (18) by the wiring board (11), the sensor cover (14), and the glass substrate (17); and an imaging lens (21) provided above the glass substrate (17) of the imaging package (10). At least one ventilation groove (G), allowing the internal space (18) to communicate with outer air, is formed on an adhesion surface of the glass substrate (17) of the sensor cover (14). |
