发明名称 |
WAFER HOLDER WITH TAPERED REGION |
摘要 |
An apparatus, a system and a method are disclosed. An exemplary apparatus includes a wafer holder including a first portion and a second portion. The first and second portions are formed of the same continuous material. The first portion includes a first upper surface and a first lower surface, and the second portion including a second upper surface and a second lower surface. The apparatus further includes an interface between the first and second portions. The interface provides for a transition such that the first upper surface of the first portion tends toward the second upper surface of the second portion. The apparatus further includes a tapered region formed in the first portion. The tapered region starts at a radial distance from a center line of the wafer holder and terminates at the interface. The tapered region has an initial thickness that gradually decreases to a final thickness.
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申请公布号 |
US2013252424(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201213426334 |
申请日期 |
2012.03.21 |
申请人 |
LIN YI-HUNG;WANG LI-TING;LEE TZE-LIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN YI-HUNG;WANG LI-TING;LEE TZE-LIANG |
分类号 |
H01L21/306;H01L21/302;H01L21/324;H01L21/477;H01L21/683 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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