PREPREG AND LAMINATED BOARD

摘要

The purpose of the present invention is to provide a prepreg that achieves a low dielectric loss tangent in a laminated board, regardless of the use of a polar solvent. The present invention relates to a prepreg prepared by impregnating or coating a base material with a varnish that comprises a resin composition including polyphenylene ether as a primary component, an inorganic filler, and a polar solvent, and then subjecting the base material to a drying step, wherein: the content of the polar solvent in the prepreg is 3 mass% or less; and the dielectric loss tangent of a laminated board prepared by using said prepreg is from 0.001 to 0.007 at 10 GHz.