A printed circuit board (PCB) includes at least two vias and at least two bonding pads corresponding to the vias. Each bonding pad is arranged on the surface of the PCB around the corresponding one of the at least two vias. Between two adjacent bonding pads, a through hole is arranged for preventing molten solder overflowing from one bonding pad to the other.
申请公布号
US2013248237(A1)
申请公布日期
2013.09.26
申请号
US201213569195
申请日期
2012.08.08
申请人
ZHOU JIE-SONG;TANG XING-HUA;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD .