| 摘要 |
A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing with the heated resin film, and adhering the coated resin film to the metal housing. The preferred housing is one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, and in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).
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