| 摘要 |
There is provided a substrate processing apparatus, including at least: a substrate holder that holds a substrate; a processing furnace including a reaction tube in which the substrate holder is loaded, and is configured to apply a specific processing to the substrate held by the substrate holder in a state that the substrate holder is loaded in the reaction tube; an operation part configured to select a maintenance recipe for the reaction tube used for substrate processing, and a maintenance recipe for both of the reaction tube and the substrate holder loaded in the reaction tube; and a control part configured to execute the maintenance recipe selected by the operation part, when a maintenance timing of the reaction tube and/or the substrate holder arrives.
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