发明名称 METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE
摘要 <p>The invention concerns a method for producing at least one pad assembly (32, 50) on a support (19, 43) intended for the implementation of a method for self-assembling at least one element (10) on the support (19, 43), and a corresponding device. The production method comprises the following successive steps: (a) forming, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm; and (b) exposing the layer (28, 48) and the location (30, 44) to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, the drop of liquid (16) having, after step (b), a static contact angle on the layer (28, 48) greater than or equal to 100°.</p>
申请公布号 WO2013140094(A1) 申请公布日期 2013.09.26
申请号 WO2013FR50598 申请日期 2013.03.20
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;STMICROELECTRONICS (CROLLES 2) SAS 发明人 DI CIOCCIO, LEA;MERMOZ, SEBASTIEN;SANCHEZ, LOIC
分类号 H01L21/98;H01L21/48;H01L21/58;H01L23/13;H01L23/14 主分类号 H01L21/98
代理机构 代理人
主权项
地址