发明名称 CIRCUIT BOARD MODULE, MANUFACTURING APPARATUS OF THE SAME, AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To enable easy folding of a circuit board module while preventing falling off of circuit components from occurring in a folding step.SOLUTION: A mounting region 10, a folding region and a cable connection region 30 are defined on a plane surface of a circuit board 1. Circuit components are mounted in the mounting region 10, and a cable connection terminal 31 is formed in the cable connection region 30. On the mounting region 10 and the cable connection region 30, sealing resins 13 and 33 are applied and are hardened. On the folding region 20, a fixing resin 23 before being hardened is applied. The circuit board 1 is folded at boundaries B1 and B2 of the sealing resins 13 and 33, thereby forming a rectangular parallelepiped circuit board module. Since the circuit components 11 are sealed with the sealing resin 13, falling off of the circuit components 11 is prevented. Moreover, since the boundaries of the sealing resins 13 and 33 become the basis of the folding, the circuit board 1 is easy to be folded.
申请公布号 JP2013191621(A) 申请公布日期 2013.09.26
申请号 JP20120054746 申请日期 2012.03.12
申请人 FUJIFILM CORP 发明人 KIDO TAKASHI
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
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