| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating on an electrode layer, whereby highly uniform film thickness and high denseness can be achieved and production cost can be reduced.SOLUTION: A method for plating on an electrode layer is intended for performing plating on a surface of the electrode layer 5 essentially comprising Al formed on a substrate 1. The method comprises: using a solution containing an amphiphilic agent and Zn ions, depositing the Zn ions in the solution onto the surface of the electrode layer 5 by the Langmuir-Blodgett method and replacing Al components in the electrode layer 5 by the Zn ions, thereby forming Zn nuclei on the surface of the electrode layer 5; and subsequently performing an electroless plating treatment. |
