MAGNETIC FIELD SENSOR INTEGRATED CIRCUIT WITH INTEGRAL FERROMAGNETIC MATERIAL

摘要

A magnetic field sensor includes a lead frame, a die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and a portion of the lead frame, and optionally a ferromagnetic mold material secured to a portion of the non-conductive mold material. The hard or soft ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may contain a separately formed element. Embodiments include die up, lead on chip, and flip-chip arrangements, integrated components, such as capacitors, on the lead frame, and a bias magnet with a lateral channel. Optional features include a slotted lead frame, a molded suppression device, a passive device lead-coupled and a ferromagnetic bead. A coil may be secured to the non-conductive mold material and a passive component may be coupled across separated portions of a lead.