发明名称 ELEMENT-ACCOMMODATING PACKAGE
摘要 An element-accommodating package (1) is provided with: a rectangular substrate (2) having on the top surface a region (R) for mounting an element; a frame (3) provided along the outer periphery of the mounting region (R) on the substrate (2), the frame (3) having a notch (C) in one section; and an input-output terminal (4) provided in the notch (C) and extending from a region surrounded by the frame (3) to a region not surrounded by the frame (3). The input-output terminal (4) includes a first insulating layer (4a), a second insulating layer (4b) laminated on the first insulating layer (4a), and a third insulating layer (4c) laminated on the second insulating layer (4b). A plurality of first terminals (6) set to a predetermined potential are provided to the top surface of the first insulating layer (4a), a plurality of second terminals (7) set to a predetermined potential are provided to the bottom surface of the first insulating layer (4a), and a plurality of third terminals (8) through which an alternating-current signal is passed are provided to the top surface of the second insulating layer (4b).
申请公布号 WO2013141013(A1) 申请公布日期 2013.09.26
申请号 WO2013JP55955 申请日期 2013.03.05
申请人 KYOCERA CORPORATION 发明人 TSUJINO, MAHIRO;KATAYAMA, EIICHI;MUKAI, EMI;OGASAWARA, ATSUSHI
分类号 H01L23/04 主分类号 H01L23/04
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