发明名称 CHIYONG YEOLYUNGCHAK YEOLJEOPHAP MOLD OF PAU ADAPTER
摘要 PURPOSE: A thermal bonding mold of a heat sealer for pouches is provided to remarkably improve sealing efficiency of the pouch by uniformly sealing the pouch through thermal bonding. CONSTITUTION: A thermal bonding mold of a heat sealer for pouches comprises a main body unit (10), a bonding unit (11), and a set screw hole (15). The bonding unit is protruding from one side of the main body. The set screw hole is positioned in a central line which is the same as a central line (13) in a longitudinal direction of the main body unit so that the bonding unit protrudes. The bonding unit is protruding to both sides of the central line in a longitudinal direction. Both sides of equal division lengths (11a,11b) of the bonding unit are formed to be asymmetric. A fitting protrusion (16) is integrally formed in both ends of the main body unit.
申请公布号 KR101311917(B1) 申请公布日期 2013.09.26
申请号 KR20120068075 申请日期 2012.06.25
申请人 CHANG, YANG SOO 发明人 CHANG, YANG SOO
分类号 B29C65/04;B65B51/10 主分类号 B29C65/04
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