PHOTOSENSITIVE RESIN COMPOSITION, CURED RELIEF PATTERN-MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition for giving a cured relief pattern with a good shape, which can be cured at low-temperature and prevents a pattern from being buried due to collapse of a relief pattern after curing; a cured relief pattern-formation method to form a pattern using the photosensitive resin composition; and a semiconductor device and a display device having the cured relief pattern.SOLUTION: A photosensitive resin composition comprises 100 pts.mass of a phenol resin mixture (A) comprising a phenol resin (A-1) having a structure represented by the formula (1) [in the formula, a, Rand X are as defined in the description] and at least one phenol resin (A-2) selected from a novolac resin or a polyhydroxystyrene resin at a mass ratio of 10/90 to 90/10; 0.1 to 70 pts.mass of a photosensitive diazonaphthoquinone compound (B); and 100 pts.mass to 1000 pts.mass of a solvent (C).