发明名称 SILVER PLATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a silver plating material excellent in wear resistance, to be used as a material of a contact or a terminal component such as a connector, a switch and a relay used in on-board or consumer electric wiring.SOLUTION: In a silver plating material, a silver plating film having a thickness of 10 μm or less is formed on a material composed of copper or a copper alloy or the like, the arithmetic average roughness Ra of the surface of the silver plating film is 0.1 μm or less, and the {111} orientation ratio of the silver plating film is 35% or higher. The silver plating material is such a silver plating material that the wear amount of the silver plating film (the thickness of the silver plating film to be worn) is smaller than 1 μm even when a silver rivet is slid 300,000 times under a load of 100 gf, that is, the ground of the silver plating material is not exposed after the silver rivet is slid 300,000 times under the load of 100 gf even though the thickness of the silver plating film is around 1 μm, so that wear resistance is extremely excellent.
申请公布号 JP2013189681(A) 申请公布日期 2013.09.26
申请号 JP20120056595 申请日期 2012.03.14
申请人 DOWA METALTECH KK 发明人 SHINOHARA KEISUKE;OGATA MASAFUMI;MIYAZAWA HIROSHI
分类号 C25D7/00;H01H1/025;H01H1/04;H01R13/03;H01R13/04 主分类号 C25D7/00
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