WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board having a highly reliable wiring junction structure which withstands stress of strain that is caused by heat expansion and contraction due to action of temperature cycles and heat shock, and to provide a manufacturing method which enables the wiring board to be easily manufactured with a small number of work hours.SOLUTION: A wiring board includes: first metal wiring; second metal wiring that is disposed so as to maintain a spatial distance relative to the first metal wiring; and metal pillars which join the first metal wiring to the second metal wiring through open holes provided at the first metal wiring. Each metal pillar is formed by joining granular metallic materials with each other.