| 摘要 |
A semiconductor device includes a semiconductor chip, a first electrode terminal, a second electrode terminal, and a connector. The semiconductor chip is carried on the first electrode terminal. The second electrode terminal is separated from the first electrode terminal. The connector includes first through third structural parts. The first structural part is connected to an electrode of the semiconductor chip via the first connecting part; the third structural part is connected to a second electrode terminal via the second connecting part; the second structural part connects the first and third structural parts; and holes are formed on at least one of the first through third structural parts. Additionally, laser ablated recesses may be formed in the first electrode terminal to align the semiconductor chip therewith.
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