发明名称 ELECTROLESS PLATING METHOD, AND METALLIC FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method and a metallic film forming method capable of forming a metallic film of excellent adhesiveness on the surface of a resin base material by a method in which the productivity and the safety are considered.SOLUTION: In an electroless plating method of forming a metal layer by electroless plating on the surface of a resin base material, ozone water containing fine ozone bubbles having the average size of 0.1-100 μm is brought into contact with the surface of the resin base material to perform a surface modification treatment for modifying the surface of the base material, and a metal layer is formed on the surface of the resin base material by the electroless plating.
申请公布号 JP2013189667(A) 申请公布日期 2013.09.26
申请号 JP20120055439 申请日期 2012.03.13
申请人 KANTO GAKUIN 发明人 WATANABE SAORI;TASHIRO KATSUHIKO;HONMA HIDEO
分类号 C23C18/30;C23C18/16 主分类号 C23C18/30
代理机构 代理人
主权项
地址