发明名称 NON-CONTACT IC LABEL AND NAMEPLATE
摘要 PROBLEM TO BE SOLVED: To provide a thin and small non-contact IC label capable of communications even when attached to a metallic body to be adhered.SOLUTION: A non-contact IC label 1 includes: a magnetic sheet 10; an IC chip 21 that is disposed on one surface 10a of the magnetic sheet; a first antenna part 25 that includes a first connection part 23 connected to the IC chip at a first end portion 25a, and is disposed on the magnetic sheet so that a second end portion 25b extends from the first connection part in a first direction E1 along the one surface of the magnetic sheet; a second antenna part 26 that includes a second connection part 24 connected to the IC chip at a first end portion 26a, and is disposed on the magnetic sheet so that a second end portion 26b extends from the second connection part in a second direction E2 opposite to the first direction; and a circuit part 22 that is disposed between the IC chip and the first connection part and between the IC chip and the second connection part, and is connected to the IC chip, the first connection part and the second connection part.
申请公布号 JP2013191233(A) 申请公布日期 2013.09.26
申请号 JP20130117930 申请日期 2013.06.04
申请人 TOPPAN PRINTING CO LTD 发明人 OMURA KUNIO;NAKAJIMA HIDEMI
分类号 G06K19/077;G06K19/07;H01Q9/16 主分类号 G06K19/077
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