| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition with a high sensitivity, a low unexposed residual film ratio, a low relative dielectric constant, and an excellent dry etching resistance.SOLUTION: The positive photosensitive resin composition contains (A) a component containing a polymer satisfying at least one of (1) and (2) described below, (B) a photoacid generator, and (D) a solvent, with: (1) a polymer comprising a constitutional unit (a1) having a residue of protecting an acid group with an acid decomposable group, and a constitutional unit (a2) represented by the specified general formula; (2) a polymer comprising the constitutional unit (a1) and a polymer comprising the constitutional unit (a2). |
