| 摘要 |
PROBLEM TO BE SOLVED: To provide an interface for wafer inspection securing smoothness of a wafer facing surface of a probe card which collectively places multiple probes in contact with multiple electrodes of multiple semiconductor devices formed in a wafer.SOLUTION: An interface of wafer inspection 18 includes: a substrate 20a; a probe card 20 where multiple probes 25, provided so as to correspond to electrodes of multiple semiconductor devices formed in a wafer W, are provided on a surface of the substrate 20a which faces the wafer W; a pogo frame 40 contacting with a surface of the probe card 20 which is opposite to the surface facing the wafer W and supporting the probe card; and a shim 51 provided on a contact surface of the probe card 20, which contacts with the pogo frame 40, and adjusting a thickness of the probe card 20. The shim 51 presents a cross shape in a plane view. |
