摘要 |
To provide a probe card that is used when carrying out electrical inspection of a high-density fine circuit board to be measured. A probe card has plural probe pins, an insulator having plural through-holes through which the probe pins pass, and a pair of substrates that are positioned at both sides of the insulator and that have supporting holes into which end portions of the probe pins are inserted respectively. The pair of substrates and the insulator are provided so as to be slidable. One substrate is formed of a material having a same value as or an approximate value of a coefficient of thermal expansion of a fine circuit board to be measured, and another substrate is formed of a material having a same value as or an approximate value of a coefficient of thermal expansion of a wiring board for signal input/output. By doing so, even if the fine circuit board to be measured and the wiring board for signal input/output thermally expand, the probe pins can always be made to contact the respective electrodes of the fine circuit board to be measured and the wiring board for signal input/output, and the probe pins that are adjacent do not short circuit. Therefore, electrical inspection of a high-density fine circuit board to be measured can be carried out at one time, and furthermore, precisely.
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