| 摘要 |
PURPOSE: A device for cutting embossed molds is provided to prevent a failure from occurring as the chips remain by preventing the chip from remaining on the embossed mold in a process driving the device. CONSTITUTION: A device for cutting embossed molds comprises a lower module (10), an embossed mold (14), an upper die (16), a horizontal driving unit (18), and a driving pump (24). The lower module fixes a substrate (30) loaded for cutting. A blade having a pattern for cutting the substrate is formed in the embossed mold. The embossed mold is equipped with a first through hole to absorb a chip between the blades. The embossed mold is installed at the upper die which is reciprocated to the horizontal direction. The horizontal driving unit horizontally moves the upper die to discharge the chip. The driving pump provides an absorption force for absorbing the chip to the first through hole of the embossed mold through the upper die. [Reference numerals] (AA) Injecting high pressure air |
