发明名称 VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus that is capable of continuously measuring evaporation rate without restoring atmospheric pressure inside a vacuum chamber, thereby avoiding reduction of productivity, and is capable of precisely determining flow rate of evaporation particles, thereby forming a vapor deposition film at a precise evaporation rate.SOLUTION: A flow rate control valve 18, which controls the degree of opening of a passage, is provided on a material transport pipe 17 that leads evaporation particles to a glass substrate 12. A first pressure sensor 21 is provided inside the material transport pipe 17 provided downstream of the flow rate control valve 18, and a second pressure sensor 22 is provided inside a vacuum chamber 11. A controller 24 is provided, which measures the evaporation rate of the evaporation particles onto the glass substrate 12 by determining the flow rate of the evaporation particles based on pressure difference (P1-P2) between pressures P1 and P2 measured by the two pressure sensors 21 and 22, and controls the degree of opening of the material transport pipe 17 by the flow rate control valve 18 so that the measured evaporation rate reaches a prescribed evaporation rate.
申请公布号 JP2013189678(A) 申请公布日期 2013.09.26
申请号 JP20120056562 申请日期 2012.03.14
申请人 HITACHI ZOSEN CORP 发明人 MATSUMOTO YUJI;NODA TAKESHI;DAIKU HIROYUKI
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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