| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a semiconductor manufacturing apparatus, capable of peeling a pasted protection tape, without contacting a rear surface of a wafer.SOLUTION: A method for manufacturing a semiconductor device includes a first step of placing a semiconductor substrate to which a protection tape is pasted through a support substrate, with the protection tape looking downward, on a stage where a peeling tape whose adhesive surface is looking upward is placed; a second step of depressurizing the semiconductor substrate under a condition in which it is placed on the adhesive surface of the peeling tape with the protection tape looking downward, so that the peeling tape is pasted to the protection tape; a third step of pulling the peeling tape toward the lower side of the stage under a condition in which the peeling tape is pasted to the protection tape, so that the protection tape is peeled; and a fourth step of supporting a surface of the support substrate which is exposed from the protection tape by pulling. |
