发明名称 |
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEGRATION WITH INTEGRATED CIRCUIT CHIPS |
摘要 |
Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.
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申请公布号 |
US2013249109(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201213631744 |
申请日期 |
2012.09.28 |
申请人 |
MA QING;SWAN JOHANNA M.;TAO MIN;GEALER CHARLES A.;ZARBOCK EDWARD A. |
发明人 |
MA QING;SWAN JOHANNA M.;TAO MIN;GEALER CHARLES A.;ZARBOCK EDWARD A. |
分类号 |
H01L23/48;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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