发明名称 |
Semiconductor Device and Method of Forming a Robust Fan-Out Package including Vertical Interconnects and Mechanical Support Layer |
摘要 |
A semiconductor device has a semiconductor die. An encapsulant is deposited around the semiconductor die. An interconnect structure having a conductive bump is formed over the encapsulant and semiconductor die. A mechanical support layer is formed over the interconnect structure and around the conductive bump. The mechanical support layer is formed over a corner of the semiconductor die and over a corner of the interconnect structure. An opening is formed through the encapsulant that extends to the interconnect structure. A conductive material is deposited within the opening to form a conductive through encapsulant via (TEV) that is electrically connected to the interconnect structure. A semiconductor device is mounted to the TEV and over the semiconductor die to form a package-on-package (PoP) device. A warpage balance layer is formed over the encapsulant opposite the interconnect structure. |
申请公布号 |
US2013249106(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201213428439 |
申请日期 |
2012.03.23 |
申请人 |
LIN YAOJIAN;CHEN KANG;GU YU;STATS CHIPPAC, LTD. |
发明人 |
LIN YAOJIAN;CHEN KANG;GU YU |
分类号 |
H01L23/538;H01L21/56 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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