发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 A semiconductor device includes a first semiconductor layer of a first conductivity type, a base layer of a second conductivity type placed above the first semiconductor layer, a second semiconductor layer of the first conductivity type placed above the base layer, multiple gate electrodes having upper end is positioned above the upper surface of the base layer, a lower end positioned below the bottom of the base layer, and contacting the first semiconductor layer, the second semiconductor layer, and the base layer through a gate insulating film, insulating component arranged above the gate electrode in which the upper surface is positioned below the upper surface of the second semiconductor layer, and a conductive layer covering the second semiconductor layer from the upper end to the bottom end.
申请公布号 US2013248995(A1) 申请公布日期 2013.09.26
申请号 US201213607533 申请日期 2012.09.07
申请人 NISHIWAKI TATSUYA;OTA TSUYOSHI;YASUHARA NORIO;ARAI MASATOSHI;KAWANO TAKAHIRO;KABUSHIKI KAISHA TOSHIBA 发明人 NISHIWAKI TATSUYA;OTA TSUYOSHI;YASUHARA NORIO;ARAI MASATOSHI;KAWANO TAKAHIRO
分类号 H01L29/78;H01L21/82;H01L27/088 主分类号 H01L29/78
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