发明名称 METHOD FOR REMOVING NON-VOLATILE COMPOUND AND ELECTRONIC DEVICE MANUFACTURED BY THE METHOD
摘要 PROBLEM TO BE SOLVED: To provide: a method for removing a residue on a dry etching stop layer produced through a dry etching process in manufacturing a bottom-gate thin film transistor or the like; and an electronic device which is low in cost and excellent in electrical characteristics.SOLUTION: A non-volatile compound is removed by second dry etching without using hydrocarbon-containing gas and halogen-containing gas, but using hydrogen gas, the non-volatile compound being produced when an indium-containing compound or the like is dry etched using mixed gas that contains hydrocarbon or the like and being deposited on a dry etching stop layer. In addition to hydrogen gas, rare gas may be contained.
申请公布号 JP2013191762(A) 申请公布日期 2013.09.26
申请号 JP20120057543 申请日期 2012.03.14
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 SHIMIZU TAKASHI
分类号 H01L21/3065;H01L21/336;H01L29/786 主分类号 H01L21/3065
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