| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical semiconductor element that allows preventing disconnection of lead-out wiring.SOLUTION: A method of manufacturing an optical semiconductor element of the present invention includes the steps of: forming stripe grooves 21 and 22; forming a protective film 15; forming a polymer part 17; etching the protective film 15 so as to expose a top surface MT of a mesa part M; and forming lead-out wiring 34. In the step of forming the polymer part 17, the polymer part 17 is formed so that a top surface 17T of the polymer part 17 has inclined surfaces 17S1 and 17S2. The step of etching includes the step of collectively etching the polymer part 17 and the protective film 15 so as to expose the top surface MT of the mesa part M. Right after forming the polymer part 17, when the inclination angle of the inclined surfaces 17S1 and 17S2 is &thetas;, the thickness of the protective film is d, and the width of the top surface MT of the mesa part M is w, the following relational expression is met: tan&thetas;≥2dR/w. |
