| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for manufacturing a semiconductor device, which can exactly determine the deterioration of an electrolytic solution used in an electrolytic plating treatment.SOLUTION: An apparatus for manufacturing a semiconductor device is provided. The apparatus for manufacturing the semiconductor device includes: a plating treatment part; a light projection part; a light receiving part; and a determination part. The plating treatment part performs an electrolytic plating treatment to a substrate. The light projection part projects a light beam to the substrate subjected to the electrolytic plating treatment. The light receiving part receives the light beam projected by the light projection part. The determination part determines the deterioration of an electrolytic solution used in the electrolytic plating treatment based on the light beam received by the light receiving part. |
